(一) FR4,FR4.1,FR5单面板及双面板认证申请
(二) cem1,cem3单面板及双面板申请
(三) FR1,FR3单面板及双面板申请
(四) FR4多层板申请
(五) 单面铝基板仅燃烧认证和全认证申请
(六) 双面铝基板仅燃烧认证和全认证申请
(七) 多层铝基板仅燃烧认证和全认证申请
(八) 铜基板 单面,双面,多层 仅燃烧认证和全认证申请
(九) 柔性线路板(软板)仅燃烧认证和全认证申请
(十) 软硬结合板仅燃烧认证和全认证申请
(十一) 线路板基材认证申请
(十二) 线路板油墨认证申请
(十三) 覆盖膜,电磁膜,屏蔽膜认证申请
(十四) 已有UL,增加CUL认证申请
(十五) 其他认证申请
(十六) XPC板材 22f板材 HB板材 V0板材
1 Scope
1.1 These requirements apply to rigid printedwiring boards and flexible printedwiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation.
1.2 The flexible printedwiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a coverlay film, with midboard connections.
1.3 These requirements do not cover flexible printedwiring boards of laminatedfilm construction in which the conductors are parallel to each other and are completely covered by the base film with only pointtopoint end connections.
1.4 These requirements do not apply to flexible, flextoinstall, rigid, and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials as flexible materials interconnect constructions (FMIC's) for use as components in devices or appliances – that are covered by the Standard for Flexible Materials Interconnect Constructions, UL F.
Cover
Transmittal
Table of Contents
Body
INTRODUCTION
1 Scope
2 Glossary
3 Units of Measurement
4 Measurement Accuracy and Testing Conditions
5 Supplementary Test Procedures
6 References
7 General
CONSTRUCTION
8 General
9 Base Materials
10 Conductors
11 Adhesives for Conductor Bonding
12 Processes
Permanent Coatings
PluggedHole Materials
Embedded Components
16 Singlelayer (Singlesided and doublesided) PrintedWiring Boards
Multilayer PrintedWiring Boards
Metal Base PrintedWiring Boards
19 Flexible PrintedWiring Boards
20 Variations In PrintedWiring Board Construction
PERFORMANCE
21 Test Samples
22 Data Collection
23 Microsection Analysis
24 Thermal Shock
25 Flammability
26 Bond Strength
27 Delamination and Blistering
28 Dissimilar Dielectric Materials Thermal Cycling Test
29 Plating Adhesion
30 Conductive Paste Adhesion Test
31 Dielectric Materials Intended for Use in Fabricating High Density Interconnect (HDI) Type Constructions
32 Silver Migration Test
MARKINGS
33 General
FOLLOWUP INSPECTION
详询Sunny 陶
